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ELECTRONICS

3D Inspection of Soldered Components

3D vision inspection uses height and profile information to evaluate soldered electronic components. The inspection task concerns solder and pin conditions that require rejection.

The challenge

What needed solving

Solder and pin defects can involve height or shape differences that are difficult to judge from a brief visual check.

The solution

How Qualitas solved it

The project concerns 3D inspection of soldered components, where height and profile information can help evaluate the solder and pins.

How the system works

Height and profile information add a geometric view of the soldered region. The choice of views and inspection limits depends on the solder and pin features that must be checked.

Results and practical value

The useful inspection output is a decision against the specified solder and pin conditions. Define those conditions using part drawings and representative acceptable and rejected samples.

Share component drawings, solder and pin features, rejected samples and the required cycle time.

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