The challenge
What needed solving
2D inspection could not catch insufficient or excess paste volume — a leading cause of solder defects after reflow that drove costly rework and field failures.
The solution
How Qualitas solved it
3D vision measured paste height, area, and volume for every pad, rejecting boards outside tolerance before components were placed — eliminating the root cause of downstream solder failures.
The full case study covers detailed system architecture, hardware configuration, algorithm pipeline, integration approach, validation data, and a step-by-step deployment timeline with ROI calculations from live production environments.
